Electroloy Technologies (Huizhou) Co., Ltd.  

Product Name: Has a Wide Range of Printing Operations and Particularly Long Downtime and Printable Period, Emco#265hf Halogen-Free Solder Paste Model NO.: EMCO#265HF Condition: New Customized: Customized Certification: RoHS base Material: No Layers: Multilayer Mode of Production: SMT metal Coating: Tin Ingredient: Lead Free Performance: High Temperature Application: SMT PCB LED Lf318 Trademark: ELECTROLOY Transport Package: 0.5kg/Jar Specification: Sn96.5/Ag3.0/Cu0.5 Origin: China/Malaysia/India HS Code: 3810100000 Product Description product descriptionElectroloy's EMCO#265HF-315PHas a wide range of printing operations and particularly long downtime and printable period.AppearanceElectroloy's EMCO # 265HF solder paste appears as a yellow-brown uniform solder paste.packageEach can of solder paste weighs about 500 grams and should be tightly sealed. The label should be accompanied by the product number, alloy composition, particle size, net weight and product batchRelated information. Solder tin cans should be placed in foam boxes and packed in cardboard boxes, each box weighing approximately 10 kg. Cartridge-type solder pastes of 600 or 1000 grams are available.Storage and shelf lifePlease store below 3-10 degrees Celsius. The validity period of the solder paste is within six months from the production date. Before using the solder paste, it needs to warm up for about 4 hours before use. Before putting the solder paste on the template, use a spoon to stir the solder paste for 1-2 minutes or the solder paste mixer for 30-60 seconds.ShipA certificate of analysis is attached to the shipment.Material Safety Data SheetProduct MSDS / SDS can be obtained from sales department.Lead-free low-temperature alloys:Alloy numberAlloy compositionFuseFeatureApplicationLF-302Sn42 / Bi58138°C Reasonable shear strength and fatigue resistance. Can be used for temperature-sensitive parts and LED welding operations.Can be used for multi-step welding and fuse-like fuses operations can also be used for nozzle and exhaust valve operations.LF-329Sn42 / Bi57/Ag1139°C The addition of silver enhances its mechanical properties, with excellent resistance to thermal fatigue.LF-323Sn64 / Bi35/Ag1170-190°CThe addition of silver enhances its mechanical properties, with excellentresistance to thermal fatigue.Lead-free medium temperature alloy:Alloy numberAlloy compositionFuseFeatureApplicationLF-307Sn96.5 / Ag3.0 / Cu0.5217-219°CExcellent mechanical properties and thermalfatigue performance. Standard SAC alloy for most SMT applications.LF-315Sn99 / Ag0.3 / Cu0.7216-228°CExcellent mechanical properties and thermal fatigue performance. Low cost SAC alloy for most SMT applications.SN100CSn99.3/Cu0.6/Ni+Ge227°CExcellent mechanical properties, bright and smooth solder joints.Excellent through-holesoldering performance.SnCu alloy instead of SAC alloy for most SMT applications.Paste fluxAlloy numberFeatureFlux classificationEM#502(HF)Halogen-free flux, with high shear strength and excellent printing ability.Can also be used for high-speed printing operations.Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue.ROL0EM#503PT(HF)Halogen-free flux, with high shear strength and excellent printing ability.Has excellent anti-collapse performance and excellent adhesion performance.Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue.ROL0EM#615Specially configured flux with excellent printability for ultra-fine pitch welding operation.Its flux can withstand high preheat temperatures and a wide range of operational reflow jobs.It shows excellent wetting on most circuit boards.ROL1EM#233Specially configured flux enhances activity on difficult-to-solder circuit boards and parts.Has excellent anti-collapse performance and excellent adhesion performance.It shows excellent wetting on most circuit boards and leaves only clean residue.ROL1EM#255Specially configured flux enhances activity on difficult-to-solder circuit boards and parts.It shows excellent wetting on most circuit boards.Has excellent anti-collapse performance and excellent adhesion performance.The residue is soft, non-sticky; can be operated on probe test.Residues are clean, printing takes longer and productivity increases.ROL1EM#265(HF)Halogen-free formulations, temperature range can be widely used, printing operation for a long time.Soft, non-stick residue enhances reliability during in-circuit testing and reduces test probe cleaning frequency.Has excellent anti-collapse performance and excellent adhesion performance.ROL0