Electroloy Technologies (Huizhou) Co., Ltd.  

Product Name: High Temperature Halogen Free Lead Free Solder Paste Soldering Flux Paste for SMT PCB LED Lf318 Model NO.: EMCO#265HF-LF318P Ingredient: Lead Free Performance: High Temperature Application: SMT PCB LED Lf318 Trademark: ELECTROLOY Transport Package: 0.5kg/Jar Specification: Sn98.5/Ag1.0/Cu0.5 Origin: China/Malaysia/India HS Code: 3810100000 Product Description Electroloy's EMCO#265HF-315P No Clean Solder Paste is a Halogen Free rosin based solder paste with a wide print process window and extremely long abandon and open time. The soft non-stick residues improve reliability of in-circuit testing and reduce the frequency of test probes cleaning.Feature:Probe-testable residueAccording to IPC J-STD-004 standard ROL0Provides enhanced activity for the robustness of PCB boards and componentsOutstanding slump resistanceOutstanding adhesion performance and printable timeExtended "printing period" intervalBright, colorless residueHalogen-freeChemical composition of the alloyThe composition of lead-free tin wire is strictly controlled in the following LF-315 specifications:Lead-free low-temperature alloys:Alloy numberAlloy compositionFuseFeatureApplicationLF-302Sn42 / Bi58138°C Reasonable shear strength and fatigue resistance. Can be used for temperature-sensitive parts and LED welding operations.Can be used for multi-step welding and fuse-like fuses operations can also be used for nozzle and exhaust valve operations.LF-329Sn42 / Bi57/Ag1139°C The addition of silver enhances its mechanical properties, with excellent resistance to thermal fatigue.LF-323Sn64 / Bi35/Ag1170-190°CThe addition of silver enhances its mechanical properties, with excellentresistance to thermal fatigue.Lead-free medium temperature alloy:Alloy numberAlloy compositionFuseFeatureApplicationLF-307Sn96.5 / Ag3.0 / Cu0.5217-219°CExcellent mechanical properties and thermalfatigue performance. Standard SAC alloy for most SMT applications.LF-315Sn99 / Ag0.3 / Cu0.7216-228°CExcellent mechanical properties and thermal fatigue performance. Low cost SAC alloy for most SMT applications.SN100CSn99.3/Cu0.6/Ni+Ge227°CExcellent mechanical properties, bright and smooth solder joints.Excellent through-holesoldering performance.SnCu alloy instead of SAC alloy for most SMT applications.Paste fluxAlloy numberFeatureFlux classificationEM#502(HF)Halogen-free flux, with high shear strength and excellent printing ability.Can also be used for high-speed printing operations.Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue.ROL0EM#503PT(HF)Halogen-free flux, with high shear strength and excellent printing ability.Has excellent anti-collapse performance and excellent adhesion performance.Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue.ROL0EM#615Specially configured flux with excellent printability for ultra-fine pitch welding operation.Its flux can withstand high preheat temperatures and a wide range of operational reflow jobs.It shows excellent wetting on most circuit boards.ROL1EM#233Specially configured flux enhances activity on difficult-to-solder circuit boards and parts.Has excellent anti-collapse performance and excellent adhesion performance.It shows excellent wetting on most circuit boards and leaves only clean residue.ROL1EM#255Specially configured flux enhances activity on difficult-to-solder circuit boards and parts.It shows excellent wetting on most circuit boards.Has excellent anti-collapse performance and excellent adhesion performance.The residue is soft, non-sticky; can be operated on probe test.Residues are clean, printing takes longer and productivity increases.ROL1EM#265(HF)Halogen-free formulations, temperature range can be widely used, printing operation for a long time.Soft, non-stick residue enhances reliability during in-circuit testing and reduces test probe cleaning frequency.Has excellent anti-collapse performance and excellent adhesion performance.ROL0